The basic dimensions of a range of modular subracks conforming to IEC 60297-3 (1984-01) and IEC 60297-4 (1995-03) for mounting in equipment according to IEC 60297-1 (1986-09) and ANSI/EIA 310-D-1992,…
Mechanical characteristics of conduction-cooled versions of Eurocard-based circuit card assemblies are described. This specification is applicable to, but not limited to, the VMEbus standard, an internal interconnect (backplane) bus intended…
Withdrawn Standard. Withdrawn Date: Jan 15, 2001. No longer endorsed by the IEEE. The mechanical design requirements for conduction-cooled and air-cooled modules of the 10SU by 6.375 in (161.9 mm)…
Withdrawn Standard. Withdrawn Date: Jan 15, 2001. No longer endorsed by the IEEE. The mechanical design requirements for a military module, format E form factor are established. The specifications of…
Withdrawn Standard. Withdrawn Date: Jan 15, 2001. The design requirements for a module designated for use in spacecraft, boosters, and other highly rugged, conductively cooled environments are established in this…
A generic standard that may be applied in all fields of electronics where equipment and installations are required to conform to the 482.6 mm (19 in) equipment practice based on…
Additional dimensions that will ensure mechanical interchangeability of subracks and plug-in units based on IEEE P1101.1 (D1.0, 1997), IEEE Std 1101.10-1996, and the environmental requirements of IEC 61587-1 (May 1998-Draft)…
The set of activities that constitute the processes that are mandatory for the development and maintenance of software, whether stand-alone or part of a system, is set forth. The management…
Superseded by 1074-1997. The set of Activities that constitute the Processes that are mandatory for the development and maintenance of software, whether stand-alone or part of a system, is provided.…
